Signetics offers advanced TQFN, FBGA(CSP), PBGA, stacked die and flex tape products for the cell phone market, to high end STBGA, 12°± wafers handling capability and Flip Chip products for networking applications.
Signetics is also moving into new specialized markets, such as fingerprint sensors, CMOS image sensors, and modules.
http://www.signetics.com/
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